![]() The Reflow Shuttle O2 enables granular monitoring of oxygen levels within each zone, allowing nitrogen consumption to be quantified and process issues detected such as oven sealing issues.ĬEO of Solderstar, Mark Stansfield said: "Reflow soldering demands precision and control. Oxygen can lead to oxide formation on metal surfaces during heating, purging the reflow process with nitrogen results in improved wetting and solder joint integrity. ![]() Precise control over O2 levels is paramount in electronics manufacturing due to its potential impact on solder joint quality. This ground-breaking consolidation of key parameters gives manufacturers comprehensive insights to make informed decisions and optimize their reflow soldering processes to achieve higher precision in their advanced soldering applications. ![]() The Reflow Shuttle O2 represents a significant advancement as the first repeatable verification tool that combines real-time oxygen (O2) measurement in parts per million (ppm), vibration levels in three axes, vacuum reading, temperature profiles, and conveyor speed onto a single robust platform. This eagerly anticipated event, to be held in Anaheim, California, marks Solderstar's debut presentation of this advanced new technology to the US market. OLDHAM, UK – Solderstar, a global leader in temperature profiling equipment for soldering processes, is set to showcase its latest innovation, the Reflow Shuttle with O2 measurement module, at the IPC Apex Expo 2024 from April 9th to 11th.
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